Invention Grant
US10668520B2 Punch die
审中-公开
- Patent Title: Punch die
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Application No.: US16033741Application Date: 2018-07-12
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Publication No.: US10668520B2Publication Date: 2020-06-02
- Inventor: Shigeru Endo , Hiroshi Nakai
- Applicant: AMADA HOLDINGS CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@55b9e009
- Main IPC: B21D28/34
- IPC: B21D28/34

Abstract:
A punch die is provided and includes a punch body extending along an axial direction of the punch die and including a punch edge portion, a key, and a punch driver. The punch die also includes a punch guide configured to removably receive the punch body therein, the punch guide including an inner hollow that receives the punch body and a keyway that receives and guides the key. The punch die further includes a retainer collar detachably coupled to the punch guide and configured to permit the punch driver to pass therethrough and be movable along the axial direction. The punch guide includes a peripheral slot that intersects the keyway of the punch guide and the retainer collar includes a cylindrical projection and an engaging projection that is rotatable to engage the peripheral slot and to be releasably aligned with the keyway.
Public/Granted literature
- US20180318903A1 PUNCH DIE Public/Granted day:2018-11-08
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