Invention Grant
- Patent Title: Laser apparatus for cutting brittle material
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Application No.: US15352385Application Date: 2016-11-15
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Publication No.: US10668561B2Publication Date: 2020-06-02
- Inventor: Michael R. Greenberg , David M. Gaudiosi , Jochen Deile
- Applicant: Coherent, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: coherent, inc.
- Current Assignee: coherent, inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Morrison & Foerster LLP
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/073 ; B23K26/00 ; B23K26/53 ; B23K26/066 ; B23K26/0622 ; B23K26/08 ; B23K26/402 ; C03B33/02 ; G02B27/09 ; G02B27/30 ; B23K26/16 ; B23K103/00

Abstract:
An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.
Public/Granted literature
- US20180133837A1 LASER APPARATUS FOR CUTTING BRITTLE MATERIAL Public/Granted day:2018-05-17
Information query
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