A laser machining method, including: liquid supplying into a rectifying chamber; the rectifying chamber attenuating disturbances in flow of the liquid supplied; a liquid injecting into a liquid oscillating chamber exclusively from one direction from a liquid inlet port arranged on only one portion of a sidewall of the liquid oscillating chamber; the liquid jetting as a jet liquid column into air from a nozzle; a laser beam focusing on the axis of the nozzle and guiding to a machining point by the jet liquid column; a surface wave of the jet liquid column generating and gradually increasing in amplitude in the direction away from the nozzle; a body of the jet liquid column atomizing when the jet liquid column strikes the workpiece on the machining point.