An enclosure part for an information handling system is disclosed that may include materials formed together into a rectangular shape. The enclosure part may have a void on a core side and a flatness equal to or less than 0.5 mm. The materials may include a sheet of carbon fiber, a piece of non-woven carbon fiber, and a non-woven glass fiber. A method for manufacturing an enclosure part using through-plane temperature control may include inserting into a mold a sheet of carbon fiber and a piece of non-woven carbon fiber, heat pressing the sheet of carbon fiber with the piece of non-woven carbon fiber, and cooling a first portion of the mold including the sheet of carbon fiber and the piece of non-woven carbon fiber more quickly than a second portion of the mold including the sheet of carbon fiber, and removing the enclosure part from the mold.