Invention Grant
- Patent Title: Method for manufacturing metal clad laminated board, method for manufacturing electronic circuit board, and rigid body pendulum type viscoelasticity measuring device
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Application No.: US16094044Application Date: 2017-05-11
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Publication No.: US10668697B2Publication Date: 2020-06-02
- Inventor: Masaya Koyama , Kiyotaka Komori , Hiroaki Takahashi , Yoshinori Matsuzaki , Tadashi Mori
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@48acd7f6
- International Application: PCT/JP2017/017792 WO 20170511
- International Announcement: WO2017/199829 WO 20171123
- Main IPC: B32B15/092
- IPC: B32B15/092 ; B32B15/08 ; H05K3/46 ; B32B38/18 ; B32B15/20 ; H05K3/38 ; B32B27/36

Abstract:
Included are removing an outermost layer or outermost layers on one side or both sides of liquid crystal polymer film; and a molding step of performing thermocompression molding on liquid crystal polymer film and metal foil stacked on the side of liquid crystal polymer film whose outermost layer is removed. A heating temperature in the molding step is in a range from a temperature equal to a melting start temperature, of the liquid crystal polymer film, measured by using a rigid body pendulum type viscoelasticity measuring device to a temperature 60° C. higher than the melting start temperature inclusive.
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