Invention Grant
- Patent Title: Label imaging and cutting
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Application No.: US15504899Application Date: 2015-07-31
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Publication No.: US10668737B2Publication Date: 2020-06-02
- Inventor: John Cridand
- Applicant: DATALASE LIMITED
- Applicant Address: GB Widnes
- Assignee: Datalase Limited
- Current Assignee: Datalase Limited
- Current Assignee Address: GB Widnes
- Agency: Adler Pollock & Sheehan P.C
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1495b3b2
- International Application: PCT/GB2015/052217 WO 20150731
- International Announcement: WO2016/027061 WO 20160225
- Main IPC: B65C9/18
- IPC: B65C9/18 ; B23K26/38 ; B41J3/407 ; B41J11/66 ; B41J11/70 ; B41J2/475 ; B41J2/44 ; B41M5/30 ; B41M5/32 ; B41M5/333 ; B41M5/323 ; B23K103/00

Abstract:
The present invention discloses a method and apparatus for imaging and cutting a label from a linerless label substrate 6, the substrate 6 comprising: a paper or polymeric film base layer; a colour change layer, incorporating a colour change compound operable to change colour in response to illumination by a laser 1; an adhesive layer; and a release layer adapted to have low adherence to the adhesive layer. The label substrate 6 is transported from a storage reel to an imaging area. At the imaging area, the label substrate 6 is selectively illuminated by laser 1 to form an image in the colour change layer. Subsequently, further laser illumination is used to cut the label substrate 6 thereby providing a single label for application to an object. The invention is characterised in that the laser spot size is varied for imaging and cutting.
Public/Granted literature
- US20170275041A1 LABEL IMAGING AND CUTTING Public/Granted day:2017-09-28
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