Invention Grant
- Patent Title: Method and apparatus for attaching components having dissimilar rates of thermal expansion
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Application No.: US16045008Application Date: 2018-07-25
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Publication No.: US10669007B2Publication Date: 2020-06-02
- Inventor: Wendell V. Twelves , Kathleen E. Sinnamon
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: F16B5/02
- IPC: F16B5/02 ; B64C9/02 ; F16B43/00
Abstract:
An example method of mounting a first component to a second component includes receiving at least a fastening assembly within an aperture established in the first component, the fastening assembly coupled to the second component via a linking member, positioning a felt metal material between the fastening assembly and the first component, securing the fastening assembly, and compressing the felt metal material during the securing.
Public/Granted literature
- US20180346097A1 METHOD AND APPARATUS FOR ATTACHING COMPONENTS HAVING DISSIMILAR RATES OF THERMAL EXPANSION Public/Granted day:2018-12-06
Information query
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