Invention Grant
- Patent Title: Right-sized thermoformed cavities for packaging items
-
Application No.: US15925676Application Date: 2018-03-19
-
Publication No.: US10669054B1Publication Date: 2020-06-02
- Inventor: Brian Hoffman , Cory Richard Boudreau , Todd Ethan Brunner , David C. Franchino , Alexandra Kay Hartford , Vivian Lin , Mohan Mahadevan , John Gaetano Matrecano , Alexandra Surasky-Ysasi , Timothy Alan Talda
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Athorus, PLLC
- Main IPC: B65B5/02
- IPC: B65B5/02 ; B65B35/24 ; B65B47/00 ; B65B61/00 ; B65B57/00 ; B65B43/42 ; B65B47/02 ; B65B47/04

Abstract:
An actuator system for fabricating a cavity within thermoplastic material includes a plurality of actuators arranged in an array. When dimensions of an item are determined, the actuator system may be programmed with data regarding such dimensions to fabricate a cavity for the item. A subset of the actuators, and distances by which each of the actuators is to be extended, may be selected based on dimensions of the item, in order to fabricate a cavity within the thermoplastic material that may accommodate the item therein. Additionally, the actuators and the distances may be selected based on intrinsic or extrinsic data regarding the item, and a cavity fabricated within the thermoplastic material may include one or more buffer zones or protective regions that are specifically formed with respect to aspects of the item.
Information query
IPC分类: