Invention Grant
- Patent Title: Glass substrate and laminate using same
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Application No.: US15552539Application Date: 2016-01-22
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Publication No.: US10669184B2Publication Date: 2020-06-02
- Inventor: Hiroki Katayama
- Applicant: Nippon Electric Glass Co., Ltd.
- Applicant Address: JP Shiga
- Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee Address: JP Shiga
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@65065179
- International Application: PCT/JP2016/051932 WO 20160122
- International Announcement: WO2016/136348 WO 20160901
- Main IPC: B32B3/02
- IPC: B32B3/02 ; C03B17/06 ; H01L23/00 ; C03C23/00 ; B23K26/60 ; B32B17/06 ; B23K26/352 ; B23K26/0622 ; B23K26/00 ; H01L23/31 ; H01L21/56 ; H01L21/02 ; B23K26/359 ; B23K101/40 ; B23K101/42 ; C03C3/093 ; C03C3/091 ; B23K103/16 ; B23K103/00

Abstract:
A technical object of the present invention is to devise a glass substrate that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and enables correct recognition of production information and the like, and a laminate using the glass substrate. In order to achieve the technical object, the glass substrate of the present invention has a total thickness variation of less than 2.0 μm and includes an information identification part formed of a plurality of dots.
Public/Granted literature
- US20180339929A1 GLASS SUBSTRATE AND LAMINATE USING SAME Public/Granted day:2018-11-29
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