Invention Grant
- Patent Title: Dielectric ceramic composition and electronic component
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Application No.: US16136767Application Date: 2018-09-20
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Publication No.: US10669207B2Publication Date: 2020-06-02
- Inventor: Takashi Fukui , Hisashi Kobuke , Atsushi Ishimoto , Masanori Abe
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f5e3fe7 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6ad4f10c
- Main IPC: C04B35/20
- IPC: C04B35/20 ; H01G4/12

Abstract:
A dielectric ceramic composition includes: Mg2SiO4 as main component; R-containing, Cu-containing, and B-containing compounds, and Li-containing glass, as sub-component. R is an alkaline earth metal. R-containing compound greater than or equal to 0.2 part by mass and less than or equal to 4.0 parts by mass, contained in terms of oxide, Cu-containing compound of greater than or equal to 0.5 part by mass and less than or equal to 3.0 parts by mass, contained in terms of oxide, and B-containing compound greater than or equal to 0.2 part by mass and less than or equal to 3.0 parts by mass, contained in terms of oxide, to 100 parts by mass of main component. Li-containing glass of greater than or equal to 2 parts by mass and less than or equal to 10 parts by mass contained to total a 100 parts by mass of main component, and sub-component excluding Li-containing glass.
Public/Granted literature
- US20190092692A1 DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT Public/Granted day:2019-03-28
Information query
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