Invention Grant
- Patent Title: Silicon nitride sintered substrate, silicon nitride sintered substrate sheet, circuit substrate, and production method for silicon nitride sintered substrate
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Application No.: US16072997Application Date: 2017-03-24
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Publication No.: US10669210B2Publication Date: 2020-06-02
- Inventor: Hisayuki Imamura , Suguru Fujita , Youichirou Kaga , Hiroyuki Teshima , Shigeyuki Hamayoshi
- Applicant: HITACHI METALS, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2ee7ab91
- International Application: PCT/JP2017/012081 WO 20170324
- International Announcement: WO2017/170247 WO 20171005
- Main IPC: C01B21/068
- IPC: C01B21/068 ; C04B35/587 ; C04B35/64 ; H05K1/03

Abstract:
Provided is a large-sized silicon nitride sintered substrate and a method for producing the same. The silicon nitride sintered substrate has a main surface 101a of a shape larger than a square having a side of a length of 120 mm. A ratio dc/de of the density dc of the central area and the density de of the end area of the main surface 101a is 0.98 or higher. The void fraction vc of the central area of the main surface 101a is 1.80% or lower, and the void fraction ve of the end area is 1.00% or lower. It is preferred that the density dc of the central area is 3.120 g/cm3 or higher, the density de of the end area is 3.160 g/cm3 or higher, and a ratio ve/vc of the void fraction vc of the central area and the void fraction ve of the end area is 0.50 or higher.
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