Provided is a silicone resin composition having a low level of contamination to gold pad portions on an LED chip during curing of the composition and is excellent in adhesiveness to the silver lead frame on a substrate formed of a reflector member. An addition-curable silicone resin composition comprising (A-1) a linear organopolysiloxane having, per molecule, two or more alkenyl groups having 2 to 8 carbon atoms, (A-2) a branched organopolysiloxane having, per molecule, two or more alkenyl groups having 2 to 8 carbon atoms, (B-1) a branched organohydrogenpolysiloxane, wherein the weight average molecular weight of the polysiloxane and the content of SiH group-containing organosilicon compounds having 1 to 10 silicon atoms are each in a specified range, (B-2) a linear organohydrogenpolysiloxane, wherein the content of SiH group-containing organosilicon compounds having 1 to 10 silicon atoms is in a specified range, and (C) an addition reaction catalyst.