Invention Grant
- Patent Title: Thin film material for processing use
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Application No.: US14760576Application Date: 2013-12-27
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Publication No.: US10669387B2Publication Date: 2020-06-02
- Inventor: Yuichiro Sumi
- Applicant: TBM CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TBM CO., LTD.
- Current Assignee: TBM CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Cantor Colburn LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5bd95213
- International Application: PCT/JP2013/085225 WO 20131227
- International Announcement: WO2014/109267 WO 20140717
- Main IPC: B32B27/20
- IPC: B32B27/20 ; C08J5/18 ; C08K3/26 ; C09D129/04 ; C08K5/098

Abstract:
Provided is a plastic thin film material, on which a process material can be applied or deposited at low cost and with high efficiency, and in which an inorganic substance powder capable of achieving a functional processing for enabling the strong adhesion of a laminated layer on the thin film material is filled at a high density. A thin film material for processing use, which contains a thermoplastic resin and an inorganic substance powder at a weight ratio of 18:82 to 50:50, and has a specific gravity of 0.60 to 1.40 inclusive and a degree of absorption of water of 0.0 to 11.0 g/m2·120 sec inclusive as measured by a Cobb method in accordance with JIS P 8140.
Public/Granted literature
- US20150353695A1 THIN FILM MATERIAL FOR PROCESSING USE Public/Granted day:2015-12-10
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