Invention Grant
- Patent Title: Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
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Application No.: US16125724Application Date: 2018-09-09
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Publication No.: US10669449B2Publication Date: 2020-06-02
- Inventor: Hongjun Zhou , Jo-Ann Theresa Schwartz , Malcolm Grief , Xiaobo Shi , Krishna P. Murella , Steven Charles Winchester , John Edward Quincy Hughes , Mark Leonard O'Neill , Andrew J. Dodd , Dnyanesh Chandrakant Tamboli , Reinaldo Mario Machado
- Applicant: Versum Materials US, LLC
- Applicant Address: US AZ Tempe
- Assignee: VERSUM MATERIALS US, LLC
- Current Assignee: VERSUM MATERIALS US, LLC
- Current Assignee Address: US AZ Tempe
- Agent Lina Yang
- Main IPC: B24B37/24
- IPC: B24B37/24 ; C09G1/02 ; C09K3/14 ; H01L21/308 ; H01L21/3105 ; H01L21/306
Abstract:
Chemical Mechanical Planarization (CMP) polishing compositions comprising composite particles, such as ceria coated silica particles, offer low dishing, low defects, and high removal rate for polishing oxide films. Chemical Mechanical Planarization (CMP) polishing compositions have shown excellent performance using soft polishing pad.
Public/Granted literature
- US20200115590A1 Composite Abrasive Particles for Chemical Mechanical Planarization Composition and Method of Use Thereof Public/Granted day:2020-04-16
Information query
