Invention Grant
- Patent Title: Adjustable hinge assembly of mounting device
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Application No.: US16147592Application Date: 2018-09-29
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Publication No.: US10669759B2Publication Date: 2020-06-02
- Inventor: Hsueh-Chin Lu , Hung-Liang Chung , Chih-Feng Chang
- Applicant: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
- Applicant Address: CN Tianjin
- Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
- Current Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
- Current Assignee Address: CN Tianjin
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@118d0cc4
- Main IPC: E05D7/04
- IPC: E05D7/04 ; E05D3/02 ; E05D5/12

Abstract:
An adjustable hinge assembly includes a first hinge leaf, a second hinge leaf hinge-coupled to the first hinge leaf, and a hinge pin. The first hinge leaf defines a first knuckle hole corresponding to the hinge pin, and the second hinge leaf defines a second knuckle hole corresponding to the hinge pin. The first hinge leaf is hinge-coupled to the second hinge leaf by the hinge pin, the first knuckle hole, and the second knuckle hole. The hinge pin is movable within the first knuckle hole to adjust a position of the first hinge leaf relative to the second hinge leaf.
Public/Granted literature
- US20200024879A1 ADJUSTABLE HINGE ASSEMBLY OF MOUNTING DEVICE Public/Granted day:2020-01-23
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