Invention Grant
- Patent Title: Evacuated core circuit board
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Application No.: US15755524Application Date: 2016-08-26
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Publication No.: US10670255B2Publication Date: 2020-06-02
- Inventor: Aldo Contarino
- Applicant: Thin Thermal Exchange Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Thin Thermal Exchange Pte. Ltd.
- Current Assignee: Thin Thermal Exchange Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Hunton Andrews Kurth LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4727e27
- International Application: PCT/AU2016/000297 WO 20160826
- International Announcement: WO2017/031528 WO 20170302
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21V29/51 ; F21V29/56 ; F21V3/00 ; F21V29/70 ; H05K1/02 ; F21V29/85 ; F21V29/89 ; F21V29/74 ; H05K1/05 ; H05K1/18 ; H05K3/06 ; H05K3/28 ; F21Y115/10 ; F21Y103/10 ; H05K3/00

Abstract:
An evacuated core circuit board (10) for dissipating heat from a heat generating electronic component, the evacuated core circuit board comprising: at least one circuit layer (12) to which the heat generating electronic component (14) is electronically coupled; a base layer (16) a comprising a body structure (19) having a substantially hollow interior (20); and a dielectric layer (18) provided between at least a portion of the circuit layer (12) and the base layer (16), wherein the hollow interior (20) is at least partially evacuated.
Public/Granted literature
- US20180209632A1 EVACUATED CORE CIRCUIT BOARD Public/Granted day:2018-07-26
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