The present invention relates to an apparatus for the vacuum-tight leading of an electric line through a high barrier film. The apparatus comprises a hollow pipe 1 having a collar 2 projecting therefrom; a high barrier film 3 having a passage hole 4 through which the hollow pipe 1 runs; and a pressing element 5 that is arranged at the side of the high barrier film 3 that is remote from the collar 2, and that urges the high barrier film 3 toward the collar 2, with the high barrier film 3 being arranged between the collar 2 of the hollow pipe 1 and the pressing element 5. The apparatus is furthermore characterized in that an electric line runs in the hollow pipe 1 that leads from the one side of the high barrier film 3 to the other side and in that a sealant is present in the hollow pipe 1 for the vacuum-tight closing of the hollow pipe 1. It is thereby possible to provide an inexpensive electric leadthrough via which larger powers can also be transferred through a high barrier film with low loss and in a diffusion-tight manner.