Invention Grant
- Patent Title: Crack sensor including polymer for healing cracks and electronic device including the same
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Application No.: US15903631Application Date: 2018-02-23
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Publication No.: US10670655B2Publication Date: 2020-06-02
- Inventor: Tae Il Kim , Dae Shik Kang , Byeong Hak Park
- Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY , Industry-Academic Cooperation Foundation of Ajou University
- Applicant Address: KR Suwon-si KR Suwon-si
- Assignee: Research & Business Foundation Sungkyunkwan University,Industry-Academic Cooperation Foundation of Ajou University
- Current Assignee: Research & Business Foundation Sungkyunkwan University,Industry-Academic Cooperation Foundation of Ajou University
- Current Assignee Address: KR Suwon-si KR Suwon-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@de418f2
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/66
Abstract:
A crack sensor with crack healing is provided. The sensor having: a substrate; a conductive layer disposed on the substrate, wherein the conductive layer contains cracks formed therein; and a polymer layer disposed between the substrate and the conductive layer, or disposed on the conductive layer and not between the substrate and the conductive layer; wherein a restoring force of the polymer layer suppresses further growth of the cracks or restores cracks.
Public/Granted literature
- US20180246165A1 CRACK SENSOR INCLUDING POLYMER FOR HEALING CRACKS AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2018-08-30
Information query
