Invention Grant
- Patent Title: Optical coupling structure between optical fiber and semiconductor laser
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Application No.: US16051935Application Date: 2018-08-01
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Publication No.: US10670819B2Publication Date: 2020-06-02
- Inventor: Masakazu Miura , Jun Miyokawa , Kazuki Yamaoka , Hajime Mori
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Marshall, Gerstein & Borun LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@51257944
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/26 ; H01S5/022 ; H01S5/0683 ; H01S5/024

Abstract:
A non-plated region is formed in a certain range from an end of a submount. The non-plated region is a portion where a plating layer is not provided, and thus a substrate of the submount is exposed. An intermediate layer is formed on the plating layer. Furthermore, a plating layer is formed on the intermediate layer. A semiconductor laser is formed on the plating layer. The position of an end of the semiconductor laser substantially coincides with the position of an end of the plating layer (the intermediate layer). That is, even in a case where there is a deviation between an end face of the intermediate layer and an end face of the semiconductor laser, the amount of this deviation is sufficiently smaller than the amount by which the intermediate layer is set back from an end face of the submount.
Public/Granted literature
- US20180335593A1 OPTICAL COUPLING STRUCTURE BETWEEN OPTICAL FIBER AND SEMICONDUCTOR LASER Public/Granted day:2018-11-22
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