Invention Grant
- Patent Title: Ruggedized solder mask material
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Application No.: US15819349Application Date: 2017-11-21
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Publication No.: US10670964B2Publication Date: 2020-06-02
- Inventor: Matthew Kelly , Mark Jeanson , Joseph Kuczynski
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Heslin Rothenberg Farley & Mesiti PC
- Agent Tihon Poltavets; Matthew M. Hulihan
- Main IPC: G03F7/032
- IPC: G03F7/032 ; G03F7/028 ; G03F7/038 ; G03F7/027 ; B23K35/22 ; G03F7/039 ; H01L21/48 ; G03F7/004 ; B23K35/02 ; B23K35/36
Abstract:
Disclosed herein are solder mask formulations that include a liquid photo imageable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.
Public/Granted literature
- US20190155154A1 RUGGEDIZED SOLDER MASK MATERIAL Public/Granted day:2019-05-23
Information query
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