Invention Grant
- Patent Title: Substrate processing system
-
Application No.: US15706871Application Date: 2017-09-18
-
Publication No.: US10671056B2Publication Date: 2020-06-02
- Inventor: Masanori Nakayama , Tsukasa Kamakura
- Applicant: HITACHI KOKUSAI ELECTRIC INC.
- Applicant Address: JP Tokyo
- Assignee: Kokusai Electric Corporation
- Current Assignee: Kokusai Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@696a6976
- Main IPC: G05B19/418
- IPC: G05B19/418 ; H01L21/67 ; G05B23/02 ; G05B19/042

Abstract:
There is provided a substrate processing system, including: a plurality of substrate processing apparatuses; a first control part installed in each of the plurality of substrate processing apparatuses and configured to transmit a first apparatus data from each of the plurality of substrate processing apparatuses; a second control part configured to receive the first apparatus data from each of the plurality of substrate processing apparatuses, generate a priority data of each of the plurality of substrate processing apparatuses based on the first apparatus data, and transmit the priority data to the first control part; and a display part configured to display the priority data thereon.
Public/Granted literature
- US20190025799A1 SUBSTRATE PROCESSING SYSTEM Public/Granted day:2019-01-24
Information query
IPC分类: