Invention Grant
- Patent Title: Chassis and heat sink for use in chassis
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Application No.: US15954748Application Date: 2018-04-17
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Publication No.: US10672430B2Publication Date: 2020-06-02
- Inventor: Haifang Zhai , Yujie Zhou , Qingqiang Guo , Hendry Xiaoping Wu , David Dong , Michael Hao Zhou
- Applicant: EMC IP Holding Company LLC
- Applicant Address: US MA Hopkinton
- Assignee: EMC IP Holding Company LLC
- Current Assignee: EMC IP Holding Company LLC
- Current Assignee Address: US MA Hopkinton
- Agency: BainwoodHuang
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@16b305bf
- Main IPC: G11B33/14
- IPC: G11B33/14 ; H05K7/20 ; G06F1/20 ; G11B33/12 ; G11B33/02 ; G11B25/04

Abstract:
The present disclosure relates to a chassis and a heat sink for use in the chassis. Disks in rows are arranged in the chassis, and the heat sink comprises an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end; an air egress channel extending from the first end to a second end opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks; an intermediate channel comprised of gaps between the disks and fluidically communicating the air ingress channel with the air egress channel; and a fan disposed in the air egress channel and being operable to form a negative pressure in the air egress channel.
Public/Granted literature
- US20180299932A1 CHASSIS AND HEAT SINK FOR USE IN CHASSIS Public/Granted day:2018-10-18
Information query
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