Invention Grant
- Patent Title: Plasma processing apparatus and plasma processing method
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Application No.: US15795368Application Date: 2017-10-27
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Publication No.: US10672593B2Publication Date: 2020-06-02
- Inventor: Tetsuhiro Iwai , Motoko Hara
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@fd79b38
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/687 ; H01L21/3065

Abstract:
A plasma processing apparatus includes: a base that has an electrode body provided with a placing surface on which a substrate is placed and a pedestal which supports the electrode body; a lid that is liftable and lowerable with respect to the base and forms a sealed space for performing plasma processing on the substrate placed on the placing surface by being lowered to come into close contact with the pedestal; a cover that is provided integrally with the lid and covers at least a part of an outer edge of the substrate placed on the placing surface when the sealed space is formed; and a guide that is disposed around the electrode body.
Public/Granted literature
- US20180130643A1 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD Public/Granted day:2018-05-10
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