Invention Grant
- Patent Title: Fabrication of a device on a carrier substrate
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Application No.: US16071684Application Date: 2017-01-20
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Publication No.: US10672608B2Publication Date: 2020-06-02
- Inventor: Kwang Hong Lee , Li Zhang , Soo Jin Chua , Eng Kian Kenneth Lee , Eugene A. Fitzgerald , Chuan Seng Tan
- Applicant: Massachusetts Institute of Technology , National University of Singapore , Nanyang Technological University
- Applicant Address: US MA Cambridge SG Singapore SG Singapore
- Assignee: Massachusetts Institute of Technology,National University of Singapore,Nanyang Technological University
- Current Assignee: Massachusetts Institute of Technology,National University of Singapore,Nanyang Technological University
- Current Assignee Address: US MA Cambridge SG Singapore SG Singapore
- Agency: Michael Best & Friedrich LLP
- International Application: PCT/SG2017/050032 WO 20170120
- International Announcement: WO2017/127026 WO 20170727
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
A method of fabricating a device on a carrier substrate, and a device on a carrier substrate. The method comprises providing a first substrate; forming one or more device layers on the first substrate; bonding a second substrate to the device layers on a side thereof opposite to the first substrate; and removing the first substrate.
Public/Granted literature
- US20190051516A1 FABRICATION OF A DEVICE ON A CARRIER SUBSTRATE Public/Granted day:2019-02-14
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