Invention Grant
- Patent Title: Plasma processing apparatus and plasma processing method
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Application No.: US15440043Application Date: 2017-02-23
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Publication No.: US10672615B2Publication Date: 2020-06-02
- Inventor: Yosuke Sato , Akio Ui , Itsuko Sakai
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@68cf6b8
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C23C16/00 ; H01L21/3065 ; H01J37/32 ; H01L21/67

Abstract:
A plasma processing, apparatus of an embodiment includes a chamber, an introducing part, a first power source, a holder, an electrode, and a second power source. The introducing part introduces gas into the chamber. The first power source outputs a first voltage for generating ions from the gas. The holder holds a substrate. The electrode is opposite to the ions across the substrate, and has a surface not parallel to the substrate. The second power source applies a second voltage to the electrode. The second voltage has a frequency lower than the frequency of the first voltage and Introduces die ions to the substrate.
Public/Granted literature
- US20180012768A1 Plasma Processing Apparatus and Plasma Processing Method Public/Granted day:2018-01-11
Information query
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