An electronic component manufacturing method includes preparing a structure including a conductive member, forming a seed metal layer including first and second portions electrically connected to the conductive member on a surface of the structure, forming a plating layer on the first portion of the seed metal layer in a state in which the second portion of the seed metal layer is covered by a first member, forming a conductive second member on the first portion of the seed metal layer via the plating layer, and etching the second portion of the seed metal layer in a state in which the plating layer is covered by the second member.