Invention Grant
- Patent Title: Replacement metal gate process for vertical transport field-effect transistors with multiple threshold voltages
-
Application No.: US16106396Application Date: 2018-08-21
-
Publication No.: US10672670B2Publication Date: 2020-06-02
- Inventor: Ruqiang Bao , Hemanth Jagannathan , Brent A. Anderson , ChoongHyun Lee
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/28 ; H01L29/78 ; H01L29/66 ; H01L23/535 ; H01L27/092 ; H01L29/08 ; H01L29/49

Abstract:
A method of forming a semiconductor structure includes forming a plurality of fins over a top surface of a bottom source/drain region disposed over a top surface of a substrate, the fins providing vertical transport channels for a plurality of vertical transport field-effect transistors. The method also includes forming a first gate conductor surrounding a first one of an adjacent pair of the plurality of fins providing a first vertical transport channel for a first vertical transport field-effect transistor, forming a second gate conductor surrounding a second one of the adjacent pair of the plurality of fins providing a second vertical transport channel for a second vertical transport field-effect transistor, and forming at least one shared gate contact to the first gate conductor and the second gate conductor, the at least one shared gate contact being formed at first ends of the adjacent pair of the plurality of fins.
Public/Granted literature
Information query
IPC分类: