Distinct gate stacks for III-V-based CMOS circuits comprising a channel cap

Invention Grant

US10672671B2 Distinct gate stacks for III-V-based CMOS circuits comprising a channel cap 审中-公开

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Patent Title: Distinct gate stacks for III-V-based CMOS circuits comprising a channel cap
Application No.: US15649182

Application Date: 2017-07-13
Publication No.: US10672671B2

Publication Date: 2020-06-02
Inventor: Takashi Ando , Martin M. Frank , Renee T. Mo , Vijay Narayanan
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Applicant Address: US NY Armonk
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
Current Assignee Address: US NY Armonk
Agency: Tutunjian & Bitetto, P.C.
Agent Vazken Alexanian
Main IPC: H01L21/8258
IPC: H01L21/8258 ; H01L27/092 ; H01L21/8238 ; H01L21/8252 ; H01L29/267 ; H01L29/66 ; H01L29/10 ; H01L29/51

Distinct gate stacks for III-V-based CMOS circuits comprising a channel cap

Abstract:

Semiconductor devices and methods of forming the same include forming a first channel region on a first semiconductor region. A second channel region is formed on a second semiconductor region. The second semiconductor region is formed from a semiconductor material that is different from a semiconductor material of the first semiconductor region. A semiconductor cap is formed on one or more of the first and second channel regions. A gate dielectric layer is formed over the nitrogen-containing layer. A gate is formed on the gate dielectric.

Public/Granted literature

US20170309519A1 DISTINCT GATE STACKS FOR III-V-BASED CMOS CIRCUITS COMPRISING A CHANNEL CAP Public/Granted day:2017-10-26

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/8258	.....衬底是半导体的，采用H01L21/822，H01L21/8252，H01L21/8254或H01L21/8256包含工艺的组合