Invention Grant
- Patent Title: Placement method for circuit carrier and circuit carrier
-
Application No.: US16262260Application Date: 2019-01-30
-
Publication No.: US10672672B2Publication Date: 2020-06-02
- Inventor: Andreas Karch
- Applicant: AB Mikroelektronik Gesellschaft mit beschraenkter Haftung
- Applicant Address: AT Salzburg
- Assignee: AB MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Current Assignee: AB MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Current Assignee Address: AT Salzburg
- Agency: Dority & Manning, P.A.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@382d0b2f
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/49 ; H05K13/04 ; H05K1/02 ; H05K3/30 ; H05K13/08 ; H01L23/00 ; H05K3/32 ; H05K3/34 ; H01L33/48 ; H01L25/13 ; H01L33/62

Abstract:
The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the a least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).
Public/Granted literature
- US20190189526A1 Placement Method for Circuit Carrier and Circuit Carrier Public/Granted day:2019-06-20
Information query
IPC分类: