Invention Grant
- Patent Title: Method of forming semiconductor device package having testing pads on a topmost die
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Application No.: US16023504Application Date: 2018-06-29
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Publication No.: US10672674B2Publication Date: 2020-06-02
- Inventor: Chen-Hua Yu , Sung-Feng Yeh , Ming-Fa Chen , Hsien-Wei Chen , Hui-Wen Liu , Ching-Pin Yuan
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/66 ; H01L21/56 ; H01L23/31 ; H01L23/544 ; H01L23/00 ; H01L25/065
Abstract:
In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.
Public/Granted literature
- US20200006164A1 Semiconductor Device Package and Method Public/Granted day:2020-01-02
Information query
IPC分类:
