In one embodiment, an apparatus for holding down a heat sink on a printed circuit board comprises a pair of hold down clips, each of the hold down clips comprising a first end for attachment to the heat sink, a resiliently compressible arm, and a retaining finger at a second end for insertion into an opening in the printed circuit board. The retaining finger is configured to exert a spring force against a lower surface of the printed circuit board when inserted into the opening to securely hold down the heat sink on an upper surface of the printed circuit board.