A semiconductor device includes a die pad, and a first lead integrally connected to the die pad. A second lead and a third lead are arranged laterally away from the first lead. A semiconductor element including a first lateral surface and a second lateral surface adjacent to each other and a third lateral surface located opposite to the first lateral surface and adjacent to the second lateral surface, is mounted on the die pad. A plurality of first conductive members electrically connects the at least part of a main electrode pad to the end on the die pad side of the second lead. A second conductive member connects a control electrode pad to the end on the die pad side of the third lead.