Invention Grant
- Patent Title: Thin electronic package elements using laser spallation
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Application No.: US15762548Application Date: 2015-09-25
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Publication No.: US10672701B2Publication Date: 2020-06-02
- Inventor: Vivek Raghunathan , Yonggang Li , Aleksandar Aleksov , Adel A. Elsherbini , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2015/052428 WO 20150925
- International Announcement: WO2017/052633 WO 20170330
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; B23K26/06 ; B23K26/36 ; H01L21/768 ; B23K103/16
Abstract:
Discussed generally herein are methods and devices for flexible fabrics or that otherwise include thin traces. A device can include a flexible polyimide material, and a first plurality of traces on the flexible polyimide material, wherein the first plurality of traces are patterned on the flexible polyimide material using laser spallation.
Public/Granted literature
- US20180308792A1 THIN ELECTRONIC PACKAGE ELEMENTS USING LASER SPALLATION Public/Granted day:2018-10-25
Information query
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