Invention Grant
- Patent Title: Semiconductor device, manufacturing method of semiconductor device, integrated substrate, and electronic device
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Application No.: US16086708Application Date: 2017-03-17
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Publication No.: US10672724B2Publication Date: 2020-06-02
- Inventor: Yuichi Yamamoto
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4145288f
- International Application: PCT/JP2017/010862 WO 20170317
- International Announcement: WO2017/169881 WO 20171005
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L21/52 ; H01L23/00 ; H01L23/02 ; H01L23/31 ; H01L23/29 ; H01L23/498 ; H01L27/146 ; H01L21/56 ; H01L21/60
Abstract:
The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.
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