Invention Grant
- Patent Title: Semiconductor package with high routing density patch
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Application No.: US16127575Application Date: 2018-09-11
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Publication No.: US10672740B2Publication Date: 2020-06-02
- Inventor: Michael Kelly , Ronald Patrick Huemoeller , David Jon Hiner
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L21/56 ; H01L23/538 ; H01L23/00 ; H01L21/683 ; H01L23/498

Abstract:
Methods and systems for a semiconductor package with high routing density routing patch are disclosed and may include a semiconductor die bonded to a substrate and a high routing density patch bonded to the substrate and to the semiconductor die, wherein the high routing density patch comprises a denser trace line density than the substrate. The high routing density patch can be a silicon-less-integrated module (SLIM) patch, comprising a BEOL portion, and can be TSV-less. Metal contacts may be formed on a second surface of the substrate. A second semiconductor die may be bonded to the substrate and to the high routing density patch. The high routing density patch may provide electrical interconnection between the semiconductor die. The substrate may be bonded to a silicon interposer. The high routing density patch may have a thickness of 10 microns or less. The substrate may have a thickness of 10 microns or less.
Public/Granted literature
- US20190043829A1 SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH Public/Granted day:2019-02-07
Information query
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