Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
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Application No.: US16158244Application Date: 2018-10-11
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Publication No.: US10672752B2Publication Date: 2020-06-02
- Inventor: Li-Hui Cheng , Jing-Cheng Lin , Po-Hao Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L25/10 ; H01L21/50 ; H01L21/56 ; H01L23/00 ; H01L21/683 ; H01L23/498 ; H01L23/538 ; H01L23/31 ; H01L21/48 ; H01L21/60
Abstract:
A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package has a redistribution layer, at least one die over the redistribution layer, through interlayer vias on the redistribution layer and aside the die and a molding compound encapsulating the die and the through interlayer vias disposed on the redistribution layer. The semiconductor package has connectors connected to the through interlayer vias and a protection film covering the molding compound and the die. The protection film is formed by a printing process.
Public/Granted literature
- US20190043849A1 SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-02-07
Information query
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