Invention Grant
- Patent Title: Conductive layer structures for substrates
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Application No.: US16379811Application Date: 2019-04-10
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Publication No.: US10672755B2Publication Date: 2020-06-02
- Inventor: Yuan-Lin Wu
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Agent Winston Hsu
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L27/16 ; H01L29/786 ; H01L27/01 ; H01L51/00 ; H01L27/02 ; H01L27/12 ; H01L29/06 ; H01L29/417 ; G02F1/133 ; G02F1/1333 ; G02F1/1343 ; G02F1/1347 ; G02F1/153 ; H01L27/32

Abstract:
An example substrate includes a surface, a plurality of thin film layers disposed on the surface, and a conductive layer disposed on the surface. The conductive layer includes a bending structure. The bending structure includes a wavy edge and includes a plurality of openings, where a shape of at least one opening of the plurality of openings has a contour having a first curved portion, and a curvature of a portion of the wavy edge is different from a curvature of the first curved portion.
Public/Granted literature
- US20190237455A1 CONDUCTIVE LAYER STRUCTURES FOR SUBSTRATES Public/Granted day:2019-08-01
Information query
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