Invention Grant
- Patent Title: Multiphase parallel direct-current (DC) to DC circuit and chip structure thereof
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Application No.: US16518373Application Date: 2019-07-22
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Publication No.: US10672757B2Publication Date: 2020-06-02
- Inventor: Jiake Wang , Yue Chen , Qiang Xie
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@17d09d2e
- Main IPC: H02M3/158
- IPC: H02M3/158 ; H01L27/02 ; H02M1/00

Abstract:
A multiphase parallel digital current (DC) to DC converter (DCDC) circuit includes a loop operational amplifier (EA) unit, N output-stage circuit units, and M drive units, where a drive unit corresponds to at least one output-stage circuit unit including a comparator (COMP) and a power stage circuit, an output end of the loop operational amplifier EA unit is connected to an input end of the drive unit, an output end of the drive unit is connected to an input end of a COMP in a corresponding output-stage circuit unit, and an output end of the COMP is connected to an input end of a power stage circuit in the same output-stage circuit unit, and an input end of the loop operational amplifier EA unit is connected to output ends of all the power stage circuits.
Information query
IPC分类: