Invention Grant
- Patent Title: Image sensor
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Application No.: US15655957Application Date: 2017-07-21
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Publication No.: US10672824B2Publication Date: 2020-06-02
- Inventor: Bo-Tsung Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A pixel unit of an image sensor is provided. The pixel unit includes a semiconductor substrate, a light-sensitive element, a contact and a protection layer. The contact is formed right on the light-sensitive element to enable electrical signals outputted from the light-sensitive element to be transmitted to a peripheral circuit. The protection layer is disposed on the light-sensitive element and surrounds the first contact. The electrical signals of the light-sensitive element can be upward transmitted to the peripheral circuit through the contact. Therefore, the light-sensitive element can occupy a big area, and high quantum efficiency (QE) is achieved accordingly.
Public/Granted literature
- US20180151618A1 IMAGE SENSOR Public/Granted day:2018-05-31
Information query
IPC分类: