Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US16282482Application Date: 2019-02-22
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Publication No.: US10672834B2Publication Date: 2020-06-02
- Inventor: Yusuke Kobayashi , Yoshihisa Iwata , Takeshi Sugimoto
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L23/528

Abstract:
According to the embodiment, a semiconductor memory device includes a first conductive layer, a second conductive layer, a first memory cell, a second memory cell, a third conductive layer, a first contact, a intermediate memory cell, a fourth conductive layer, a third memory cell, a fifth conductive layer, and a second contact. The third conductive layer is separated from the first conductive layer and the second conductive layer in a third direction crossing a first direction and crossing a second direction and extends in the second direction. The fifth conductive layer is separated from the second conductive layer in the third direction and extends in the second direction. A first length of the second conductive layer along the second direction is shorter than a second length of the fifth conductive layer along the second direction.
Public/Granted literature
- US20190189693A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2019-06-20
Information query
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