Invention Grant
- Patent Title: High density vertically integrated FEOL MIM capacitor
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Application No.: US15363954Application Date: 2016-11-29
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Publication No.: US10672862B2Publication Date: 2020-06-02
- Inventor: Karthik Balakrishnan , Kangguo Cheng , Pouya Hashemi , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent L. Jeffrey Kelly, Esq.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L49/02 ; H01L27/12

Abstract:
A metal-insulator-metal (MIM) capacitor is provided on a surface of an insulator layer that is located on a handle substrate. The MIM capacitor includes a first metal structure extending upwards from a first portion of the insulator layer, a second metal structure extending upwards from a second portion of the insulator layer, and an oxide fin located between the first and second metal structures, wherein the oxide fin directly contacts an entirety of a sidewall surface of the first metal structure and an entirety of a sidewall surface of the second metal structure, the oxide fin having a topmost surface that is coplanar with a topmost surface of both the first and second metal structures.
Public/Granted literature
- US20170125510A1 HIGH DENSITY VERTICALLY INTEGRATED FEOL MIM CAPACITOR Public/Granted day:2017-05-04
Information query
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