Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US15979492Application Date: 2018-05-15
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Publication No.: US10672873B2Publication Date: 2020-06-02
- Inventor: Chia-Chung Chen , Chi-Feng Huang , Victor Chiang Liang , Chung-Hao Chu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L31/032 ; H01L29/94 ; H01L29/10 ; H01L21/762 ; H01L23/528 ; H01L21/768

Abstract:
Provided is a semiconductor device including a substrate having a first conductivity type, an isolation structure, a well region having the first conductivity type, a gate structure, and doped regions having a second conductivity type. The isolation structure is disposed in the substrate to form an active region of the substrate. The well region is disposed in the active region and surrounds sidewalls of the isolation structure to form a native region in the active region. The gate structure is disposed over the substrate in the native region. The doped regions are disposed respectively in the well region and the native region of the substrate at two sides of the gate structure. A method of fabricating the semiconductor device is also provided.
Public/Granted literature
- US20190355817A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-11-21
Information query
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