Invention Grant
- Patent Title: Silicon carbide semiconductor device and a method for forming a silicon carbide semiconductor device
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Application No.: US16224225Application Date: 2018-12-18
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Publication No.: US10672875B2Publication Date: 2020-06-02
- Inventor: Roland Rupp , Guenther Ruhl , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5283d885
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/16 ; H01L29/36 ; H01L29/417 ; H01L21/02 ; H01L21/265 ; H01L21/324 ; H01L29/41 ; H01L29/78

Abstract:
A method for forming a silicon carbide semiconductor device includes forming at least one graphene layer on a surface of a semiconductor substrate and forming a silicon carbide layer of the silicon carbide semiconductor device on the at least one graphene layer. At least one of forming the silicon carbide layer and forming the at least one graphene layer includes: heating the semiconductor substrate an inert gas atmosphere until a predefined temperature is reached.
Public/Granted literature
- US20190123148A1 Silicon Carbide Semiconductor Device and a Method for Forming a Silicon Carbide Semiconductor Device Public/Granted day:2019-04-25
Information query
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