Invention Grant
- Patent Title: Thin film transistor array panel and conducting structure
-
Application No.: US16069517Application Date: 2016-12-13
-
Publication No.: US10672880B2Publication Date: 2020-06-02
- Inventor: Po-Li Shih , Yi-Chun Kao , Hsin-Hua Lin , Chih-Lung Lee , Wei-Chih Chang , I-Min Lu
- Applicant: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: HONG FU JIN PRECISION INDUSTRY (SheZhen) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONG FU JIN PRECISION INDUSTRY (SheZhen) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: ScienBiziP, P.C.
- International Application: PCT/CN2016/109559 WO 20161213
- International Announcement: WO2017/121218 WO 20170720
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L27/12 ; H01L29/24 ; H01L29/786 ; H01L21/441 ; H01L21/4763 ; H01L21/477 ; H01L29/66 ; H01L29/417 ; H01L21/443

Abstract:
A conductive layer for a thin film transistor (TFT) array panel includes a multi-layered portion defining a source electrode and a drain electrode of a TFT device, and includes a first sub-layer, a second sub-layer, a third sub-layer, and at least one additional sub-layer. The third and the first sub-layers include indium and zinc oxide materials. An indium to zinc content ratio in the first sub-layer is greater than that in the third sub-layer. An indium to zinc content ratio in the additional sub-layer is formulated between that in the first and the third sub-layers. The content ratio differentiation between the first and the third sub-layers affects a lateral etch profile associated with a gap generated in the second conductive layer between the source and the drain electrodes, where the associated gap width in the third sub-layer is wider than that in the first sub-layer.
Public/Granted literature
- US20190027506A1 THIN FILM TRANSISTOR ARRAY PANEL AND CONDUCTING STRUCTURE Public/Granted day:2019-01-24
Information query
IPC分类: