Photovoltaic cell having a coupled expanded metal article
Abstract:
Methods include providing an expanded metal article configured as a mesh. The expanded metal article has a plurality of cuts in the mesh and has a surface comprising a plurality of solder pads. A semiconductor material is provided, having a back surface comprising a plurality of silver pads. A front surface of the semiconductor material serves as a light-incident surface of the photovoltaic cell. A front metallic article is provided, the front metallic article comprising a plurality of electroformed elements interconnected to form a unitary, free-standing piece comprising a continuous grid. The continuous grid of the front metallic article is electrically coupled with the front surface of the semiconductor material. The plurality of cuts of the expanded metal article is arranged to relieve stresses induced by the front metallic article on the front surface of the semiconductor material.
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IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L31/00 对红外辐射、光、较短波长的电磁辐射,或微粒辐射敏感的,并且专门适用于把这样的辐射能转换为电能的,或者专门适用于通过这样的辐射进行电能控制的半导体器件;专门适用于制造或处理这些半导体器件或其部件的方法或设备;其零部件(H01L51/42优先;由形成在一共用衬底内或其上的多个固态组件,而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00)
H01L31/04 .用作光伏〔PV〕转换器件(制造中其测试入H01L21/66;制造之后其测试入H02S50/10)
H01L31/042 ..单个光伏电池的光伏模块或者阵列(用于光伏模块的支撑结构入H02S20/00)
H01L31/044 ...包括旁路二极管的(接线盒中的旁路二极管入H02S40/34)
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