Invention Grant
- Patent Title: Filling material, resin composition, package, and light-emitting device
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Application No.: US16117930Application Date: 2018-08-30
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Publication No.: US10672955B2Publication Date: 2020-06-02
- Inventor: Yuji Akazawa , Koichi Okada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Hunton Andrews Kurth LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1f3d76bb
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/60 ; C08K9/02 ; C08L77/06 ; H01L33/56 ; C08L101/12 ; B29L31/34 ; B29C45/14 ; B29K77/00

Abstract:
A filling material for a resin composition includes a base material, a coating material coating at least a portion of a surface of a particle of the base material, and a light-reflective material disposed on the surface of the particle of the base material and supported by the coating material. The base material includes a first inorganic compound containing a Group II element. The coating material includes a second inorganic compound containing the Group II element. The second inorganic compound is different from the first inorganic compound. The light-reflective material includes a third inorganic compound having a refractive index higher than a refractive index of the first inorganic compound. A method of manufacturing the filling material is provided. A resin composition including the filling material, a package, a light-emitting device, and methods of manufacturing them are also provided.
Public/Granted literature
- US20190067528A1 FILLING MATERIAL, RESIN COMPOSITION, PACKAGE, LIGHT-EMITTING DEVICE, AND METHODS OF MANUFACTURING SAME Public/Granted day:2019-02-28
Information query
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