A method for manufacturing a light emitting device includes providing a frame having a through hole extending from a frame upper surface to a frame lower surface in a height direction. The frame has a communication path extending from a frame outer lateral surface to a frame inner lateral surface on the frame lower surface. A support body is provided on the frame lower surface. A light emitting element is provided on a support body upper surface in the through hole. Resin is injected into the through hole via the communication path to provide a covering member in the through hole such that at least a part of an element upper surface of the light emitting element is exposed from the covering member. A light-transmissive member is provided on the element upper surface and the covering member. The support body is removed.