A method of manufacturing a substrate for a light emitting device includes: forming wiring to form a plurality of first wiring parts and second wiring parts on/above an upper surface of a base member; forming projection parts including a first projection part on each of the first wiring parts and a second projection part on each of the second wiring parts by forming a first metal film on a region including at least parts of the first wiring parts and the second wiring parts and etching the first metal film using a resist for forming projection part; and forming an alignment mark by forming a second metal film on the substrate and etching the second metal film using a resist, wherein the resist for forming the projection part and the resist for forming alignment mark are exposed to light in an identical step of exposing to light.