Invention Grant
- Patent Title: Electrochemical cell packaging material
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Application No.: US14353198Application Date: 2012-11-08
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Publication No.: US10673030B2Publication Date: 2020-06-02
- Inventor: Hirohisa Akita , Masataka Okushita , Daisuke Watanabe , Kazuhiko Yokota
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@73110ddf com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6d2a23be com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6712686c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4ffc53c5
- International Application: PCT/JP2012/078990 WO 20121108
- International Announcement: WO2013/069730 WO 20130516
- Main IPC: H01M2/02
- IPC: H01M2/02 ; B32B27/30 ; B32B27/38 ; B32B7/12 ; B32B15/085 ; H01M10/052

Abstract:
Provided is an electrochemical cell packaging material with excellent electrolyte resistance. An electrochemical cell packaging material includes the following in a laminated structure: a substrate layer that, at a minimum, includes resin film; a protective layer that is arranged as the outermost layer and protects the substrate layer; a thermal adhesion layer that is arranged as the innermost layer and which includes thermal adhesion resin; and a barrier layer that includes metal foil and is arranged between the substrate layer and the thermal adhesion layer. The protective layer is formed of an epoxy resin that has bisphenol A or bisphenol F as an element in the backbone.
Public/Granted literature
- US20140335403A1 ELECTROCHEMICAL CELL PACKAGING MATERIAL Public/Granted day:2014-11-13
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