According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.